journal：IEEE Transactions on Software Engineering
Authors：Michael Fu; Chakkrit Tantithamthavorn
Published date：2023-2-1
DOI：10.1109/tse.2022.3158252
PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9732669
Article link：http://dx.doi.org/10.1109/tse.2022.3158252
Article Source：Institute of Electrical and Electronics Engineers (IEEE)。
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