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[Elsevier] Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array

prasadmandade Post time The day before yesterday 13:07 | Show all posts |Read mode
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journal：Journal of Cleaner Production

Authors：Chien-Hung Kuo; Allen H. Hu; Lance Hongwei Hung; Kuei-Tzu Yang; Chen-Hua Wu

Published date：2020-12-

DOI：10.1016/j.jclepro.2020.124301

PDF link：https://www.sciencedirect.com/sc ... 959652620343468/pdf

Article link：http://dx.doi.org/10.1016/j.jclepro.2020.124301

Article Source：Elsevier BV。


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TJ0695 Post time The day before yesterday 13:16 | Show all posts

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