A surface-mount photonic package with a photonic-wire-bonded glass interposer as a hybrid integration platform for co-packaged optics

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journal：2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Authors：Hiroshi Uemura; Taichi Misawa; Yasutaka Mizuno; Naoki Itabashi; Hajime Arao; Tetsuya Nakanishi; Keiji Tanaka; Tomomi Sano; Katsumi Uesaka; Mami Miyairi; Yoshikatsu Ishizuki; Taiji Sakai; Yoichiro Kurita

Published date：2024-5-28

DOI：10.1109/ectc51529.2024.00024

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10565110

Article link：http://dx.doi.org/10.1109/ectc51529.2024.00024

Article Source：IEEE。

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[IEEE] A surface-mount photonic package with a photonic-wire-bonded glass interposer as a hybrid integration platform for co-packaged optics

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