Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology

Post time The day before yesterday 09:03

journal：2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Authors：Lewis Kang; Jay Kim; Bruce Lee; Jade Park; Han Ju Yu; Sung Hyuk Lee; Jacinta Aman Lim; Min Ji Lee; Seong Hwan Han; Jae Kyung Lee; Hailey Hwang

Published date：2024-5-28

DOI：10.1109/ectc51529.2024.00262

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10565226

Article link：http://dx.doi.org/10.1109/ectc51529.2024.00262

Article Source：IEEE。

Remark：

Post time The day before yesterday 09:03

: This post has been completed
Completed attachments will be deleted within 24 hours.

[IEEE] Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology

Best Answer

Same Category

Latest Reply

Announcement

Enthusiastic users today

[IEEE] Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology Copy

Best Answer

Same Category

Latest Reply

Announcement

Enthusiastic users today

[IEEE] Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology