journal：IEEE Electrical Insulation Magazine
Authors：B. Biswas; B. X. Du; M. Florkowski; T. Hammarstrom; M. D. Judd; W. Koltunowicz; B. Kordi; M. Kuniewski; G. Ma; C. Pan; C. Park; A. K. Pradhan; L. Satish; G. Stone
Published date：2024-7-
DOI：10.1109/mei.2024.10568085
PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10568085
Article link：http://dx.doi.org/10.1109/mei.2024.10568085
Article Source：Institute of Electrical and Electronics Engineers (IEEE)。
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