journal:IEEE Solid-State Circuits Magazine
Authors:Wanghua Wu
Published date:2021--
DOI:10.1109/mssc.2021.3111430
PDF link:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9620737
Article link:http://dx.doi.org/10.1109/mssc.2021.3111430
Article Source:Institute of Electrical and Electronics Engineers (IEEE)。
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