journal:2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
Authors:Shijie Bi; Zhe Li; Gehao Sheng
Published date:2022-10-30
DOI:10.1109/ceidp55452.2022.9985280
PDF link:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9985280
Article link:http://dx.doi.org/10.1109/ceidp55452.2022.9985280
Article Source:IEEE。
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