journal:2021 Asian Conference on Innovation in Technology (ASIANCON)
Authors:Yesudasu Vasimalla; Himansu Shekhar Pradhan
Published date:2021-8-27
DOI:10.1109/asiancon51346.2021.9544743
PDF link:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9544743
Article link:http://dx.doi.org/10.1109/asiancon51346.2021.9544743
Article Source:IEEE。
Remark: |