journal:Journal of Electronic Packaging
Authors:Jae Choon Kim; Zongqing Ren; Anil Yuksel; Ercan M. Dede; Prabhakar R. Bandaru; Dan Oh; Jaeho Lee
Published date:2021-3-1
DOI:10.1115/1.4047414
PDF link:http://asmedigitalcollection.asm ... p_143_01_010801.pdf
Article link:http://dx.doi.org/10.1115/1.4047414
Article Source:ASME International。
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