[Other] Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

RabbiRifat Post time 6 day(s) ago | Show all posts |Read mode
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journal:Journal of Electronic Packaging

Authors:Jae Choon Kim; Zongqing Ren; Anil Yuksel; Ercan M. Dede; Prabhakar R. Bandaru; Dan Oh; Jaeho Lee

Published date:2021-3-1

DOI:10.1115/1.4047414

PDF link:http://asmedigitalcollection.asm ... p_143_01_010801.pdf

Article link:http://dx.doi.org/10.1115/1.4047414

Article Source:ASME International


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