[IEEE] Enhancing Defect Detection Using Lock In Thermography

liuxinquan Post time 2024-6-15 20:40:37 | Show all posts |Read mode
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journal:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Authors:Doaa Mohamed; Daniel May; Kaushal Arun Pareek; Mohamad Abo Ras; Bernhard Wunderle

Published date:2024-4-7

DOI:10.1109/eurosime60745.2024.10491470

PDF link:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10491470

Article link:http://dx.doi.org/10.1109/eurosime60745.2024.10491470

Article Source:IEEE


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Georgee Post time 2024-6-15 20:40:38 | Show all posts

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