journal:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Authors:Doaa Mohamed; Daniel May; Kaushal Arun Pareek; Mohamad Abo Ras; Bernhard Wunderle
Published date:2024-4-7
DOI:10.1109/eurosime60745.2024.10491470
PDF link:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10491470
Article link:http://dx.doi.org/10.1109/eurosime60745.2024.10491470
Article Source:IEEE。
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