[IEEE] Effect of Micron Thermal Conductive Filler on Thermal Conductivity and Electrical Properties of Epoxy Composites

pu3aisyah Post time 2024-6-20 17:19:56 | Show all posts |Read mode
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journal:2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

Authors:Rui Tuo; Yiran Zhang; Wei Yang; Shaojian He; Qing Xie; Jun Lin; Xingming Bian

Published date:2019-10-

DOI:10.1109/ceidp47102.2019.9009895

PDF link:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9009895

Article link:http://dx.doi.org/10.1109/ceidp47102.2019.9009895

Article Source:IEEE


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