journal:2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
Authors:Rui Tuo; Yiran Zhang; Wei Yang; Shaojian He; Qing Xie; Jun Lin; Xingming Bian
Published date:2019-10-
DOI:10.1109/ceidp47102.2019.9009895
PDF link:https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9009895
Article link:http://dx.doi.org/10.1109/ceidp47102.2019.9009895
Article Source:IEEE。
Remark: |